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1
Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications
Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications
J.H. Choy, | 대한금속.재료학회 | 2004 ,
2
Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
J.H. Choy, K.L. Kavanagh, Y.C. Kim, | 대한금속.재료학회 | 2004 ,
3
Effects of Dietary Supplemental Megazone(R) on Growth Performance, Nutrients Digestibility, Blood Characteristics, Meat Quality and Carcass Traits in Weaning-to-Finishing Pigs
Effects of Dietary Supplemental Megazone(R) on Growth Performance, Nutrients Digestibility, Blood Characteristics, Meat Quality and Carcass Traits in Weaning-to-Finishing Pigs
Y. H. Kim , Y. Wang, | 한국축산식품학회 | 2006 ,
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