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3 Results:AA:CHUNG TR AA:SANG YONG KIM 0.203 sec.
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1
A Study on the Corrosion Effects by Addition of Complexing Agent in the Copper CMP Process
A Study on the Corrosion Effects by Addition of Complexing Agent in the Copper CMP Process
Sang Yong Kim, | 한국전기전자재료학회 | 2004 ,
2
Failure Analysis for High via Resistance by HDP CVD System for IMD Layer
Failure Analysis for High via Resistance by HDP CVD System for IMD Layer
Sang Yong Kim, | 한국전기전자재료학회 | 2003 ,
3
A Study on Characterization and Modeling of Shallow Trench Isolation in Oxide Chemical Mechanical Polishing
A Study on Characterization and Modeling of Shallow Trench Isolation in Oxide Chemical Mechanical Polishing
Sang Yong Kim, | 한국전기전자재료학회 | 2002 ,
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