본문

  1. Home
4 Results:AA:LEE SANG YUN 0.124 sec.
RSS 
Multilingual
 การค้นหาขั้นสูง
 เดินทางมาถึงค้นหาวัสดุใหม่
พิมพ์ที่เลือก Select Export to Excel
1
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Hyo Sang Lee, | 한국전기전자재료학회 | 2008 ,
2
Regular Paper : Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization
Regular Paper : Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization
Yun Zhuang, | 한국전기전자재료학회 | 2008 ,
3
An Efficient Positioning Algorithm using Ultrasound and RF
An Efficient Positioning Algorithm using Ultrasound and RF
Seung Beom Kim, | 제어자동화시스템공학회 | 2008 ,
4
Performance Analysis of Entropy-based Multi-Robot Cooperative Systems in a MANET
Performance Analysis of Entropy-based Multi-Robot Cooperative Systems in a MANET
Sang-Chul Kim, | 제어자동화시스템공학회 | 2008 ,
처음1마지막