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1
Diamond Conditioner Wear Characterization for a Copper CMP Process
Diamond Conditioner Wear Characterization for a Copper CMP Process
L. Boruckia, | 한국전기전자재료학회 | 2008 ,
2
Regular Paper : Physics of the Coefficient of Friction in CMP
Regular Paper : Physics of the Coefficient of Friction in CMP
Len Borucki, | 한국전기전자재료학회 | 2008 ,
3
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Hyo Sang Lee, | 한국전기전자재료학회 | 2008 ,
4
Regular Paper : Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization
Regular Paper : Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization
Yun Zhuang, | 한국전기전자재료학회 | 2008 ,
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