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1
A Study of the Electrical Properties at the Interface in MIS Structure with Low-Dielectric-Constant SiOC(-H) Films Deposited by Using UV-Source -Assisted PECVD
A Study of the Electrical Properties at the Interface in MIS Structure with Low-Dielectric-Constant SiOC(-H) Films Deposited by Using UV-Source -Assisted PECVD
Chang Young Kim, | 한국물리학회 | 2007 ,
2
Formation Mechanism and Structural Characteristics of Low-Dielectric-Constant SiOC(-H) Films Deposited by Using Plasma-Enhanced Chemical-Vapor Deposition with DMDMS and O₂ Precursors
Formation Mechanism and Structural Characteristics of Low-Dielectric-Constant SiOC(-H) Films Deposited by Using Plasma-Enhanced Chemical-Vapor Deposition with DMDMS and O₂ Precursors
Chang Young Kim, | 한국물리학회 | 2007 ,
3
Low-Dielectric-Constant SiOC(-H) Films Prepared from DMDMS and O₂ Precursors by Using Plasma Enhanced Chemical Vapor Deposition
Low-Dielectric-Constant SiOC(-H) Films Prepared from DMDMS and O₂ Precursors by Using Plasma Enhanced Chemical Vapor Deposition
Seung Hyung Kim, | 한국물리학회 | 2007 ,
4
Comparative Study on the Structural and Electrical Properties of Low-k SiOC(-H) Films Deposited by Using Plasma Enhanced Chemical Bapor Deposition
Comparative Study on the Structural and Electrical Properties of Low-k SiOC(-H) Films Deposited by Using Plasma Enhanced Chemical Bapor Deposition
Anvar Sagatovich Zakirov, | 한국물리학회 | 2007 ,
5
Deposition and Characterization of Low-dielectric-Constant SiOC(-H) Thin Films for Interlayer Dielectrics in Multilevel Interconnections
Deposition and Characterization of Low-dielectric-Constant SiOC(-H) Thin Films for Interlayer Dielectrics in Multilevel Interconnections
Rangaswamy Navamathavan, | 한국물리학회 | 2007 ,
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