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1
Effects of Hydrogen Annealing on the Thermoelectric Properties of Electrodeposited Bi₂Te₃ for Nanowire Applications
Effects of Hydrogen Annealing on the Thermoelectric Properties of Electrodeposited Bi₂Te₃ for Nanowire Applications
Sung-woo Jun., | 한국물리학회 | 2006 ,
2
Electrodeposition 변수에 따른 Trench Via의 Cu Filling 특성
Electrodeposition 변수에 따른 Trench Via의 Cu Filling 특성
이광용, | 한국마이크로전자및 패키징학회 | 2006 ,
3
Electrodeposition 변수에 따른 Sn 도금의 표면 거칠기와 플립칩 접속된 Sn 범프의 접속저항
Electrodeposition 변수에 따른 Sn 도금의 표면 거칠기와 플립칩 접속된 Sn 범프의 접속저항
정부양, | 한국마이크로전자및 패키징학회 | 2006 ,
4
Nanoscale Control of High-Quality Electrode Materials for the Electrochemical Performances
Nanoscale Control of High-Quality Electrode Materials for the Electrochemical Performances
Joon Gon Lee, | 대한금속재료학회 | 2006 ,
5
Determination of Salicy by Selective Poly(vinylchloride) Membrane Electrode Based on N,N'-1,4-Butylene Bis(3-methyl salicylidene iminato) Copper(Ⅱ)
Determination of Salicy by Selective Poly(vinylchloride) Membrane Electrode Based on N,N'-1,4-Butylene Bis(3-methyl salicylidene iminato) Copper(Ⅱ)
Ardakani, M. Mazloum, | 대한화학회 | 2006 ,
6
Pre-Annealing Effect of Electroless Ni-B Deposit as a Diffusion Barrier for Electroplated Cu Electrodes
Pre-Annealing Effect of Electroless Ni-B Deposit as a Diffusion Barrier for Electroplated Cu Electrodes
Jae Woong Choi, Gil Ho Hwang, Won Kyu Han, Sung G, | Korean Institute of Metals and Materials | 2006 ,
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