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1
Experiments on the Thermal Stratification in the Branch of NPP
Experiments on the Thermal Stratification in the Branch of NPP
Sang-Nyung Kim, Seon-Hong Hwang, Ki-Hoon Yoon, | 대한기계학회 | 2005 ,
2
Local Flow Speed Measurement Using Tunable AC Thermal Anemometry
Local Flow Speed Measurement Using Tunable AC Thermal Anemometry
Won Seok Chung, Ohmyoung Kwon, Joon Sik Lee, Youn, | 대한기계학회 | 2005 ,
3
Effects of Thermal Contact Resistance on Film Growth Rate in a Horizontal MOCVD Reactor
Effects of Thermal Contact Resistance on Film Growth Rate in a Horizontal MOCVD Reactor
Ik-Tae Im, Nag Jung Choi, Masakazu Sugiyame, Yosh, | 대한기계학회 | 2005 ,
4
Experimental Study on the Thermal Performance of a Small-scale Loop Heat Pipe with Polypropylene Wick
Experimental Study on the Thermal Performance of a Small-scale Loop Heat Pipe with Polypropylene Wick
Joon Hong Boo, Won Bok Chung, | 대한기계학회 | 2005 ,
5
An Experimental Study on the Thermal Performance of a Concentric Annular Heat Pipe
An Experimental Study on the Thermal Performance of a Concentric Annular Heat Pipe
Joon Hong Boo, Soo Yong Park, Do Hyoung KIm, | 대한기계학회 | 2005 ,
6
Thermal Transient Characteristics of Die Attach in High Power LED Package
Thermal Transient Characteristics of Die Attach in High Power LED Package
Hyun-Ho Kim, Sang-Hyun Choi, Sang-Hyun Shin, Youn, | 한국마이크로전자및 패키징학회 | 2005 ,
7
A Synthesis of Spherical Shape TiO₂-SiO₂Complex via Solvothermal Process and Thermal Properties at Non-Isothermal
A Synthesis of Spherical Shape TiO₂-SiO₂Complex via Solvothermal Process and Thermal Properties at Non-Isothermal
Tae-Hwan Cho, Seong-Jin Park, | 한국마이크로전자및 패키징학회 | 2005 ,
8
고집적용 구리배선의 electromigration 및 thermal fatigue 연구
고집적용 구리배선의 electromigration 및 thermal fatigue 연구
김영후, 박영배, Reiner Moning, Cynthia A. Volkert, 주영창, | 한국마이크로전자및 패키징학회 | 2005 ,
9
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Myung Jin Yim, Hyoung Joon Kim, Kyung Wook Paik, | 한국마이크로전자및 패키징학회 | 2005 ,
10
Round Robin Analysis for Probabilistic Structural Integrity of Reactor Pressure Vessel under Pressurized Thermal Shock
Round Robin Analysis for Probabilistic Structural Integrity of Reactor Pressure Vessel under Pressurized Thermal Shock
Myung Jo Jhung, Changheui Jang, Seok Hun Kim, You, | 대한기계학회 | 2005 ,
처음12이후마지막
1
International Symposium on Transport Phenomena in Thermal Engineering
대한기계학회 [, ]
2
International Symposium on Transport Phenomena in Thermal Engineering
대한기계학회 [공학, ]
3
Journal of Thermal Analysis & Calorimetry
Kluwer Academic Publishing / Academic [, ]
4
Journal of Thermal Stresses
Taylor & Francis Ltd [, ]
5
KSME/JSME THERMAL and FLUID Engineering Conference
대한기계학회 [공학, ]
6
KSME/JSME THERMAL and FLUID Engineering Conference
대한기계학회 [, ]
7
Thermal Science
Society of Thermal Engineers of Serbia [, ]