본문

Multilingual
1
In Kyoung Sung, Chang Jin Oh, Eung Suk Lee, Ock H, | 대한기계학회 | 2005 ,
2
Su Cheol Gong, In Jea Back, Jae Hyouk Yoo, Hun Se, | 한국마이크로전자및 패키징학회 | 2005 ,
3
K. Habib, | 한국부식방식학회(구)한국부식학회 | 2005 ,
4
Sehyun Shin, Ju-Hee Jang, Myung-Soo Park, Yunhee, | 대한기계학회 | 2005 ,
5
J. B. Kim, S. J. Na, W. S. Chang, M. J. Choi, | 대한기계학회 | 2005 ,
6
Seung-Soo Kim, Hye-Jin Lee, Hyoung-Wook Lee, Nak-, | The Korean Institute of Electrical Eng. | 2005 ,
1
University of Wisconsin Press [, ]
2
Springer - Verlag New York, Inc. [, ]
3
4
World Scientific Publishing Company [, ]
5
6
Blackwell Publishing Limited [, ]
7
MAIK Nauka Interperiodica [, ]