본문

  1. Home
1 Results:SS:FLIP 0.35 sec.
RSS 
Multilingual
 Расширенный поиск
 Новый поиск книги прибытия
Selected Print Select Export to Excel
1
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Myung Jin Yim, Hyoung Joon Kim, Kyung Wook Paik, | 한국마이크로전자및 패키징학회 | 2005 ,
처음1마지막
1
Journal of Liposome Research
Marcel Dekker Inc. [, ]