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Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Myung Jin Yim, Hyoung Joon Kim, Kyung Wook Paik, | 한국마이크로전자및 패키징학회 | 2005 ,
2
Condensation Heat Transfer Coefficients of Flammable Refrigerants on Various Enhanced Tubes
Condensation Heat Transfer Coefficients of Flammable Refrigerants on Various Enhanced Tubes
Ki-Jung Park, Dongsoo Jung, | 대한기계학회 | 2005 ,
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