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1
Effects of Temperature and Mechanical Deformation on the Microhardness of Lead free and Composite Solders
Effects of Temperature and Mechanical Deformation on the Microhardness of Lead free and Composite Solders
Joo Won Lee, Sung K. Kang, Hyuck Mo Lee, | 한국마이크로전자및 패키징학회 | 2005 ,
2
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Moon Gi Cho, Hyuck Mo Lee, Seong Woon Booh, Tae-, | 한국마이크로전자및 패키징학회 | 2005 ,
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