본문

  1. Home
8 Results:AA:KIM SAM JIN 0.156 sec.
RSS 
Multilingual
 การค้นหาขั้นสูง
 เดินทางมาถึงค้นหาวัสดุใหม่
พิมพ์ที่เลือก Select Export to Excel
1
보강토 옹벽 전면블록의 마찰특성 평가
보강토 옹벽 전면블록의 마찰특성 평가
김진만 ( Jin Man Kim ), | 한국지반공학회 | 2005 ,
2
Characterization of Antioxidant Potential of a Methanolic Extract and Its Fractions of Highbush Blueberry (Vaccinium corymbosum L.)
Characterization of Antioxidant Potential of a Methanolic Extract and Its Fractions of Highbush Blueberry (Vaccinium corymbosum L.)
Mahinda Senevirathne, | 한국식품영양과학회 | 2005 ,
3
cDNA Isolation and Characterization of (+)-Germacrene A Synthase from Ixeris dentata form. albiflora Hara
cDNA Isolation and Characterization of (+)-Germacrene A Synthase from Ixeris dentata form. albiflora Hara
Min Young Kim, | 한국식물학회(Adventitous Root Formation | 2005 ,
4
Effects of Benzyladenine and Abscisic Acid on the Disassembly Process of Photosystems in an Arabidopsis Delayed-Senescence Mutant, ore9
Effects of Benzyladenine and Abscisic Acid on the Disassembly Process of Photosystems in an Arabidopsis Delayed-Senescence Mutant, ore9
Min Hyuk Oh, | 한국식물학회(Adventitous Root Formation | 2005 ,
5
V-band Self-heterodyne Wireless Transceiver using MMIC Modules
V-band Self-heterodyne Wireless Transceiver using MMIC Modules
Dan An, Mun-Kyo Lee, Sang-Jin Lee, Du-Hyun Ko, Ji, | 대한전자공학회 | 2005 ,
6
Chemical Model for the Solvent Extraction of GdCl₃from a Chloride Solution with Saponified PC88A
Chemical Model for the Solvent Extraction of GdCl₃from a Chloride Solution with Saponified PC88A
Man-Seung Lee, | 대한금속재료학회 | 2005 ,
7
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Myung Jin Yim, Hyoung Joon Kim, Kyung Wook Paik, | 한국마이크로전자및 패키징학회 | 2005 ,
8
Round Robin Analysis for Probabilistic Structural Integrity of Reactor Pressure Vessel under Pressurized Thermal Shock
Round Robin Analysis for Probabilistic Structural Integrity of Reactor Pressure Vessel under Pressurized Thermal Shock
Myung Jo Jhung, Changheui Jang, Seok Hun Kim, You, | 대한기계학회 | 2005 ,
처음1마지막