1
Yong-Eui Choi, Emiko Harada, Gwang-Hoon Kim, Eui-,
| 한국식물학회 |
2004
,
3
Bikash C. Sarker, M. Hara, M. Uemura,
| 한국식물학회 |
2004
,
4
W. J. Feng, R. K. L. Su,
| 국제구조공학회(TECNO-PRESS) |
2004
,
5
Alper llki, Nahit Kumbasar, Pinar Ozdemir, Toshib,
| 국제구조공학회(TECNO-PRESS) |
2004
,
6
Rajeh Z. Al-Zaid,
| 국제구조공학회(TECNO-PRESS) |
2004
,
7
Chartree Lertsima, Taweep Chaisomphob, Eiki Yamag,
| 국제구조공학회(TECNO-PRESS) |
2004
,
8
Hyoung Seop Kim,
| 대한금속.재료학회 |
2004
,
9
Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
J.H. Choy, K.L. Kavanagh, Y.C. Kim,
| 대한금속.재료학회 |
2004
,
10
Wonseok Jung, Dongho Bae, Ilseon Sohn,
| 대한기계학회 |
2004
,
1
2
3
4
5
John Wiley & Sons Inc.
[, ]
6
Harvard Health Publications
[, ]
7
8
9
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