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Shear Strength and Aging Characteristics of 63Sn-37Pb Solder Bumps with Various Solder Ball and Pad Sized
Shear Strength and Aging Characteristics of 63Sn-37Pb Solder Bumps with Various Solder Ball and Pad Sized
Jin-Won Choi,Ho-Seob Cha, | 대한금속.재료학회 | 2003 ,
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Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
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Schulz-Kirchner Verlag GmbH [, ]