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1
Dynamic Young's Modulus and Internal Friction in Polycrystalline Copper
Dynamic Young's Modulus and Internal Friction in Polycrystalline Copper
Chang-Seog Kang,Si-Young Chang,Sung-Kil Hong, | 대한금속.재료학회 | 2003 ,
2
Reaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
Reaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
Jeong-Won Yoon,Chang-Bae Lee, | 대한금속.재료학회 | 2003 ,
3
An Electrochemical Study on the Effect of Pitting Inhinition in Weakly Alkaline Solution by Copper Addition in Pure Iron
An Electrochemical Study on the Effect of Pitting Inhinition in Weakly Alkaline Solution by Copper Addition in Pure Iron
Je-Kyoung Kim, | 대한금속.재료학회 | 2003 ,
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