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1
Fabrication of SOI Structures with Buried Cavities Using Si Wafer Direct Bonding and Electrochemical Etch-stop
Fabrication of SOI Structures with Buried Cavities Using Si Wafer Direct Bonding and Electrochemical Etch-stop
Gwiy-Sang Chung, | 대한금속.재료학회 | 2003 ,
2
Bond Strength of Reinforcement in Splices in Beams
Bond Strength of Reinforcement in Splices in Beams
Kazim Turk,M Sukru Yildirim, | 국제구조공학회 | 2003 ,
3
Anti-Plane Shear Behavior of an Arbitrarily Oriented Crack in Bonded Materials with a Nonhomogeneous Interfacial Zone
Anti-Plane Shear Behavior of an Arbitrarily Oriented Crack in Bonded Materials with a Nonhomogeneous Interfacial Zone
Yong Moon Chung,Chul Kim,Hyung Jip Choi, | 대한기계학회 | 2003 ,
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1
Coxey's Program, 1894--1 Non-Interest-Bearing Bond Bill
Great Neck Publishing [, ]
2
Grover Cleveland's Appeal for Gold Guarantee on Bonds
Great Neck Publishing [, ]