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1
The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
Seong Min Lee, | 한국전기전자재료학회 | 2002 ,
2
Effect of Impurities on Stress Induced Void Formation in A1 - 1%Si Conductors
Effect of Impurities on Stress Induced Void Formation in A1 - 1%Si Conductors
Seong Min Lee, | 한국전기전자재료학회 | 2002 ,
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