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Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
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In-Sup Ahn, Sung-Yeal Bae, and You-Young Kim,
| 대한금속.재료학회 |
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| 대한금속.재료학회 |
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| 대한금속.재료학회 |
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2003
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Great Neck Publishing
[, ]
2
3
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