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821
Effect of the Substrate Temperatures on the Epitaxial rearrangement of the Deposited Au Nanoclusters
Effect of the Substrate Temperatures on the Epitaxial rearrangement of the Deposited Au Nanoclusters
S.C.Lee,Nong M. Hwang,B.D.Yu, | 대한금속.재료학회 | 2002 ,
822
Calcium Phosphate Forming Ability of Thermally Oxidized Titanium Implant
Calcium Phosphate Forming Ability of Thermally Oxidized Titanium Implant
Kyu-Soeg Hwang,Yeon-Hum Yun, | 대한금속.재료학회 | 2002 ,
823
Effect of Grain Boundary Energy on Surface-Energy Induced Abnormal Grain Growth in Columnar-Grained Film
Effect of Grain Boundary Energy on Surface-Energy Induced Abnormal Grain Growth in Columnar-Grained Film
Jung-Kyu Jung,Nong-Moon Hwang, | 대한금속.재료학회 | 2002 ,
824
A Study on the Modeling of Parameters Affecting the IR Drop Mechanism in the Initiation Stage of Crevice Corrosion
A Study on the Modeling of Parameters Affecting the IR Drop Mechanism in the Initiation Stage of Crevice Corrosion
Hyun-Youn Chang, Yong-Soo Park,Woon-Suk Hwang, | 대한금속.재료학회 | 2000 ,
825
Investigation of Primary and Secondary Creep Deformation Mechanism of TiAl
Investigation of Primary and Secondary Creep Deformation Mechanism of TiAl
Soo W.Nam,H.S.Cho,Sun-Keun Hwang, | 대한금속.재료학회 | 2000 ,
826
서양문헌에 나타난 풍수의 개념
서양문헌에 나타난 풍수의 개념
Hwangbo, A.B., | 대한건축학회 | 2001 ,
827
2 wt% Te를 과잉으로 첨가한 25% Bi2Te3-75% Sb2Te3 단결정에서 Sb2Se3의 첨가가 전기적특성과 열전특성에 미치는 영향
2 wt% Te를 과잉으로 첨가한 25% Bi2Te3-75% Sb2Te3 단결정에서 Sb2Se3의 첨가가 전기적특성과 열전특성에 미치는 영향
H.P.Ha, D.B.Hyun, J.S. Hwang, | 대한금속.재료학회 | 2000 ,
828
Modal Analysis of Eccentric Shells With Fluid-Filled Annulus
Modal Analysis of Eccentric Shells With Fluid-Filled Annulus
Myung Jo Jhung, Kyeong Hoon Jeong and Won Gul Hwa, | 국제구조공학회 | 2002 ,
829
Techniques & standards for image.vedio & audio coding
Techniques & standards for image.vedio & audio coding
Rao, K. R., 567-R215t | Prentice Hall | 1996 567-R215t,
830
Advanced computer architecture : parallelism, scalability, programmability
Advanced computer architecture : parallelism, scalability, programmability
Hwang, Kai, 004.2-H991a | McGraw-Hill Book Company | 1993 004.2-H991a,
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