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811
The Bonding of Interstitial Hydrogen in the NiTi Intermetallic Compound
The Bonding of Interstitial Hydrogen in the NiTi Intermetallic Compound
Dae-Bok Kang, | 대한화학회 | 2006 ,
812
Photodissociation Dynamics of Formic Acid at 206 nm
Photodissociation Dynamics of Formic Acid at 206 nm
Tae Yeon Kang, | 대한화학회 | 2006 ,
813
Development of Embedded Non-Volatile FRAMs for High Performance Smart Cards
Development of Embedded Non-Volatile FRAMs for High Performance Smart Cards
Kang-Woon Lee, | 대한전자공학회 | 2004 ,
814
Wafer Level Vacuum Packaged Out-of-Plane and In-Plane Differential Resonant Silicon Accelerometers for Navigational Applications
Wafer Level Vacuum Packaged Out-of-Plane and In-Plane Differential Resonant Silicon Accelerometers for Navigational Applications
Illhwan Kim, | 대한전자공학회 | 2005 ,
815
Design of Broad Band Amplifier Using Feedback Technique
Design of Broad Band Amplifier Using Feedback Technique
Tae-Shin Kang, | 대한전자공학회 | 2003 ,
816
Improved Breakdown Voltage Characteristics of In0.5Ga0.5P/In0.22Ga0.78As/GaAs p-HEMT with an Oxidized GaAs Gate
Improved Breakdown Voltage Characteristics of In0.5Ga0.5P/In0.22Ga0.78As/GaAs p-HEMT with an Oxidized GaAs Gate
I-H.Kang, | 대한전자공학회 | 2003 ,
817
See-saw Type RF MEMS Switch with Narrow Gap Vertical Comb
See-saw Type RF MEMS Switch with Narrow Gap Vertical Comb
Sungchan Kang, | 대한전자공학회 | 2007 ,
818
RF MEMS Switches and Integrated Switching Circuits
RF MEMS Switches and Integrated Switching Circuits
Sungchan Kang, | 대한전자공학회 | 2007 ,
819
Cell Signal Distribution Characteristics For High Density FeRAM
Cell Signal Distribution Characteristics For High Density FeRAM
Hee-Bok Kang, | 대한전자공학회 | 2004 ,
820
A Wafer Level Packaged Limiting Amplifier for 10Gbps Optical Transmission System
A Wafer Level Packaged Limiting Amplifier for 10Gbps Optical Transmission System
Chul-Won Ju, | 대한전자공학회 | 2004 ,
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