본문

  1. Home
1000 Results:AA:M LEE 0.921 sec.
RSS 
다국어입력
 상세검색
 신착검색
선택출력 선택엑셀내보내기
811
Large-scale Culture of Plant Cell and Tissue by Bioreactor System
Large-scale Culture of Plant Cell and Tissue by Bioreactor System
Sung Ho Son, | 한국식물학회 | 1999 ,
812
Characterization of Albino Tobaccos (Nicotiana tabacum L.) Derived from Leaf Blade-Segments Cultured in vitro
Characterization of Albino Tobaccos (Nicotiana tabacum L.) Derived from Leaf Blade-Segments Cultured in vitro
Chang Hyu Bae, | 한국식물학회 | 1999 ,
813
Herbicide Resistant Cabbage ( Brassica oleracea ssp. capitata ) Plants by Agrobacterium - mediated Transformation
Herbicide Resistant Cabbage ( Brassica oleracea ssp. capitata ) Plants by Agrobacterium - mediated Transformation
Yeon Hee Lee, | 한국식물학회 | 2000 ,
814
Technical Development for Large DNA Fragment Transformation in Plants
Technical Development for Large DNA Fragment Transformation in Plants
Su Ryun Choi, | 한국식물학회 | 2000 ,
815
Structure and Function of NtCDPK1 , a Calcium - dependent Protein Kinase in Tobacco
Structure and Function of NtCDPK1 , a Calcium - dependent Protein Kinase in Tobacco
Gyeong Mee Yoon, | 한국식물학회 | 2000 ,
816
Design and Implementation of Map Databases for Telematics and Car Navigation Systems using and Embedded DBMS
Design and Implementation of Map Databases for Telematics and Car Navigation Systems using and Embedded DBMS
Yong Jin Joo, | 한국GIS학회 | 2007 ,
817
Development and application of a GIS based groundwater modeling system
Development and application of a GIS based groundwater modeling system
Saro Lee, | 한국GIS학회 | 2002 ,
818
Regular Paper : Characterization of Silver Saturated-Ge45Te55 Solid Electrolyte Films Incorporated by Nitrogen for Programmable Metallization Cell Memory Device
Regular Paper : Characterization of Silver Saturated-Ge45Te55 Solid Electrolyte Films Incorporated by Nitrogen for Programmable Metallization Cell Memory Device
Soo Jin Lee, | 한국전기전자재료학회 | 2008 ,
819
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Hyo Sang Lee, | 한국전기전자재료학회 | 2008 ,
820
Regular Paper : Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization
Regular Paper : Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization
Yun Zhuang, | 한국전기전자재료학회 | 2008 ,
처음이전77787980818283848586이후마지막