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751
Optimum Design on Lobe Shapes of Gerotor Oil Pump
Optimum Design on Lobe Shapes of Gerotor Oil Pump
J. H. Kim., | 대한기계학회 | 2006 ,
752
Effectiveness of Leakage Control after Application of Permeation Grouting to Earth Fill Dam
Effectiveness of Leakage Control after Application of Permeation Grouting to Earth Fill Dam
Byung Sik Chun., | 대한토목학회 | 2006 ,
753
The Combined Electrokinetic and Ultrasonic Remediation of Sand Contaminated with Heavy Metal and Organic Substance
The Combined Electrokinetic and Ultrasonic Remediation of Sand Contaminated with Heavy Metal and Organic Substance
Ha Ik Chung., | 대한토목학회 | 2006 ,
754
Utilization of Stabilized and Solidified Sewage Sludge as a Daily Landfill Cover Material
Utilization of Stabilized and Solidified Sewage Sludge as a Daily Landfill Cover Material
Ha Ik Chung., | 대한토목학회 | 2006 ,
755
On Optimal Sampling Design for Rainfall Field
On Optimal Sampling Design for Rainfall Field
Chulsang Yoo., | 대한토목학회 | 2006 ,
756
Active Sensing-based Real-time Nondestructive Evaluations for Steel Bridge Members
Active Sensing-based Real-time Nondestructive Evaluations for Steel Bridge Members
Seunghee Park., | 대한토목학회 | 2006 ,
757
High Speed Pulse-based Flip-Flop wiht Pseudo MUX-type Scan for Standard Cell Library
High Speed Pulse-based Flip-Flop wiht Pseudo MUX-type Scan for Standard Cell Library
Min-su Kim., | 대한전자공학회 | 2006 ,
758
Low Voltage Program/ Erase Characteristics of Si Nanocrystal Memory with Damascene Gate FinFET on Bulk Si Wafer
Low Voltage Program/ Erase Characteristics of Si Nanocrystal Memory with Damascene Gate FinFET on Bulk Si Wafer
Jeong-Dong Choe., | 대한전자공학회 | 2006 ,
759
Fabrication and Electrical Properties of Local Damascene FinFET Cell Array in Sub-60nm Feature Sized DRAM
Fabrication and Electrical Properties of Local Damascene FinFET Cell Array in Sub-60nm Feature Sized DRAM
Yong-Sung Kim., | 대한전자공학회 | 2006 ,
760
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Young Kun Jee, | 대한금속재료학회 | 2006 ,
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