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701
Friction Mechanisms of Silicon Wafer and Silicon Wafer Coated with Diamond like Carbon Film and Two Monolayers
Friction Mechanisms of Silicon Wafer and Silicon Wafer Coated with Diamond like Carbon Film and Two Monolayers
R. Arvind Singh., | 대한기계학회 | 2006 ,
702
The Effect of Office Layouts and Ambient Office Sounds on the Simple Tasks of White Collar Workers
The Effect of Office Layouts and Ambient Office Sounds on the Simple Tasks of White Collar Workers
Heakyung Cecilia Yoon., | 대한건축학회 | 2006 ,
703
Field Testing and Capacity-Ratings of a Short-Span Bridge Superstructures Made of Advanced Composite Materials
Field Testing and Capacity-Ratings of a Short-Span Bridge Superstructures Made of Advanced Composite Materials
Hyo Seon Ji., | 대한토목학회 | 2006 ,
704
Usage of Foodservice Systems Management Competencies by Korean Dietitians
Usage of Foodservice Systems Management Competencies by Korean Dietitians
H. Jeong., | 대한지역사회영양학회 | 2006 ,
705
A Low-Power ECC Check Bit Generator Implementation in DRAMs
A Low-Power ECC Check Bit Generator Implementation in DRAMs
Sand Uhn Cha., | 대한전자공학회 | 2006 ,
706
Electromigration Behaviors of SnAgCu Solder Lines
Electromigration Behaviors of SnAgCu Solder Lines
Min Seung Yoon, | 대한금속재료학회 | 2006 ,
707
Synthesis and Electrochemical Performances of LiNi(0.4)Mn(0.4)Co(0.2)O2 Cathode Material for Lithium Rechargeable Battery
Synthesis and Electrochemical Performances of LiNi(0.4)Mn(0.4)Co(0.2)O2 Cathode Material for Lithium Rechargeable Battery
Min Seung Yoon, | 대한금속재료학회 | 2006 ,
708
Fabrication of Ni-Co Alloy Nanoparticles on a Polymer Film
Fabrication of Ni-Co Alloy Nanoparticles on a Polymer Film
Jung Hoon Kim, | 대한금속재료학회 | 2006 ,
709
Nanocarving Process : Selective and Anisotropic Gas Phase Etching of Bulk TiO2 Crystal into Oriented Arrays of Nanofibers
Nanocarving Process : Selective and Anisotropic Gas Phase Etching of Bulk TiO2 Crystal into Oriented Arrays of Nanofibers
Se Hoon Yoo, | 대한금속재료학회 | 2006 ,
710
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Young Kun Jee, | 대한금속재료학회 | 2006 ,
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