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W. J. Feng, R. K. L. Su,
| 국제구조공학회(TECNO-PRESS) |
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Alper llki, Nahit Kumbasar, Pinar Ozdemir, Toshib,
| 국제구조공학회(TECNO-PRESS) |
2004
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Rajeh Z. Al-Zaid,
| 국제구조공학회(TECNO-PRESS) |
2004
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Chartree Lertsima, Taweep Chaisomphob, Eiki Yamag,
| 국제구조공학회(TECNO-PRESS) |
2004
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A. M. Afsar, S. R. Ahmed,
| 국제구조공학회(TECNO-PRESS) |
2005
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Hyoung Seop Kim,
| 대한금속.재료학회 |
2004
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Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
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2004
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Wonseok Jung, Dongho Bae, Ilseon Sohn,
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2004
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2004
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5
John Wiley & Sons Inc.
[, ]
6
Harvard Health Publications
[, ]
7
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9
לפי
לעדן
פורמט
מחבר
- Shang Hyon Shin (2+)
- Bae Sungjin (1+)
- Asish Parida, Anath Bandhu Das, Premananda Das (1+)
- Amos A. Fatokun. (1+)
- Alper llki, Nahit Kumbasar, Pinar Ozdemir, Toshib (1+)
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