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Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
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2004
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John Wiley & Sons Inc.
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Harvard Health Publications
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- Shang Hyon Shin (2+)
- Bae Sungjin (1+)
- Asish Parida, Anath Bandhu Das, Premananda Das (1+)
- Amos A. Fatokun. (1+)
- Alper llki, Nahit Kumbasar, Pinar Ozdemir, Toshib (1+)
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