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551
Al2O3 Nano-Coating by Atomic Layer Deposition
Al2O3 Nano-Coating by Atomic Layer Deposition
Byung Don Min, | 한국전기전자재료학회 | 2004 ,
552
A Layout-Based CMOS RF Model for RFIC`s
A Layout-Based CMOS RF Model for RFIC`s
Kwang Min Park, | 한국전기전자재료학회 | 2004 ,
553
Polymer Layer Effects on Anchoring Strength and Surface Ordering in NLC, 5CB, by the Washing Process after Rubbing on the Polyimide Surfaces
Polymer Layer Effects on Anchoring Strength and Surface Ordering in NLC, 5CB, by the Washing Process after Rubbing on the Polyimide Surfaces
Sang Keuk Lee, | 한국전기전자재료학회 | 2004 ,
554
The Structural and Electrical Properties of NiCr Alloy for the Bottom Electrode of High Dielectric (Ba,Sr)TiO3 (BST) Thin Films
The Structural and Electrical Properties of NiCr Alloy for the Bottom Electrode of High Dielectric (Ba,Sr)TiO3 (BST) Thin Films
Eung Min Lee, | 한국전기전자재료학회 | 2004 ,
555
Polar Anchoring Strength and Surface Ordering in NLC by the Washing Process on Rubbed Polymer Surfaces Containing Trifluoromethyl Moiety
Polar Anchoring Strength and Surface Ordering in NLC by the Washing Process on Rubbed Polymer Surfaces Containing Trifluoromethyl Moiety
Sang Keuk Lee, | 한국전기전자재료학회 | 2003 ,
556
Regular paper : Effect of Dry Process on Dielectric Properties of PZT Thin Films Prepared by Sol - Gel Process
Regular paper : Effect of Dry Process on Dielectric Properties of PZT Thin Films Prepared by Sol - Gel Process
Min Ho Bae, | 한국전기전자재료학회 | 2003 ,
557
Regular paper : Effects of Deposition Temperature and Annealing Process on PZT Thin Films Prepared by Pulsed Laser Deposition
Regular paper : Effects of Deposition Temperature and Annealing Process on PZT Thin Films Prepared by Pulsed Laser Deposition
Min Chul Kim, | 한국전기전자재료학회 | 2003 ,
558
Regular Paper : A 1.5 V High - Gain High - Frequency CMOS Complementary Operational Amplifier
Regular Paper : A 1.5 V High - Gain High - Frequency CMOS Complementary Operational Amplifier
Kwang Min Park, | 한국전기전자재료학회 | 2002 ,
559
The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
The Effect of Manipulating Package Construct and Leadframe Materials on Fracture Potential of Plastically Encapsulated Microelectronic Packages During thermal Cycling
Seong Min Lee, | 한국전기전자재료학회 | 2002 ,
560
Microstructural and Piezoelectric Characteristics of PSN - PMN - PZT Ceramics Produced by Attrition Milling
Microstructural and Piezoelectric Characteristics of PSN - PMN - PZT Ceramics Produced by Attrition Milling
Ju Hyun Yoo, | 한국전기전자재료학회 | 2002 ,
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