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511
A Study on μBGA Solder Joints Reliability Using Lead-free Solder Materials
A Study on μBGA Solder Joints Reliability Using Lead-free Solder Materials
Youn-Eui Shin,Jun-Hwan Lee,Young-Wook Koh,Chong-W, | 대한기계학회 | 2002 ,
512
Corrosion Resistance of Fe₂O₃-Cr₂O₃Artificial Passive Films Formed with LP-MOCVD
Corrosion Resistance of Fe₂O₃-Cr₂O₃Artificial Passive Films Formed with LP-MOCVD
Hyun-Soo Kim,Jae-Hong Yoon,Kee-Sam Shin, | 대한금속.재료학회 | 2002 ,
513
Effects of Synthesized 4PBO,PBSO₄on the Initial Capacity and Cycle Performance of Lead Dioxide Electrode Prepared by Cementation Leady Oxide
Effects of Synthesized 4PBO,PBSO₄on the Initial Capacity and Cycle Performance of Lead Dioxide Electrode Prepared by Cementation Leady Oxide
Joon Ho Shin,Young taek Lim,Ki Won Kim, | 대한금속.재료학회 | 2001 ,
514
Epitavial Deposition of NiO Film on an Cube-Textured Ni Substrate By Metal-Organic Chemical Vapor Deposition
Epitavial Deposition of NiO Film on an Cube-Textured Ni Substrate By Metal-Organic Chemical Vapor Deposition
Hee-Hyoun Lee, Young-Min Lee,Hyung-Sik Shin, | 대한금속.재료학회 | 2000 ,
515
A Mathematical Model of Unidirectional Solidification in Cooled Mold
A Mathematical Model of Unidirectional Solidification in Cooled Mold
Yun-Ho Shin,Choon Sik Kang,Kyu Hwan Oh, | 대한금속.재료학회 | 2000 ,
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