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41
Physiology of Rhizoctonia solani AG2-2(IV), Trichoderma harzianum, and Chaetomium cochliodes, and their Utilization of Thatch-related Carbohydrate in Zoysia japonica
Physiology of Rhizoctonia solani AG2-2(IV), Trichoderma harzianum, and Chaetomium cochliodes, and their Utilization of Thatch-related Carbohydrate in Zoysia japonica
Jin-Hee Park, | 한국잔디학회 | 1998 ,
42
Are Positional Concerns Stronger in Some Domains than in Others?
Are Positional Concerns Stronger in Some Domains than in Others?
Solnick, S. J., | American Economic Assn | 2005 ,
43
Verifying the Solution from a Nonlinear Solver: A Case Study: Reply
Verifying the Solution from a Nonlinear Solver: A Case Study: Reply
B. D. McCullough, | American Economic Assn | 2004 ,
44
Malthus to Solow
Malthus to Solow
Hansen, G. D., | American Economic Assn | 2002 ,
45
Effects of Nitrogen Concentration and NO₃⁻:NH₄⁺ Ratio of Nutrient Solution on Stock Plant Growth, Cutting Yield, and Quality in Kalanchoe blossfeldiana
Effects of Nitrogen Concentration and NO₃⁻:NH₄⁺ Ratio of Nutrient Solution on Stock Plant Growth, Cutting Yield, and Quality in Kalanchoe blossfeldiana
Sun Hwa Kim, | 한국원예학회 | 2007 ,
46
Development of Nutrient Solution for Chenopodiaceae Leaf Vegetables Based on Nutrient-Water Absorption Rate and Cation Ratio
Development of Nutrient Solution for Chenopodiaceae Leaf Vegetables Based on Nutrient-Water Absorption Rate and Cation Ratio
Hua Zi Huang, | 한국원예학회 | 2007 ,
47
Production of Chrysanthemum Transplants as Affected by Hydroponic Systems, Electrical Conductivity in Nutrient Solution, and Photosynthetic Photon Flux
Production of Chrysanthemum Transplants as Affected by Hydroponic Systems, Electrical Conductivity in Nutrient Solution, and Photosynthetic Photon Flux
Sun-Ja kim, | 한국원예학회 | 2006 ,
48
전자세라믹스 / Sol-Gel 법으로 제조한 (Ba, Sr)TiO3 박막의 전기적 특성
전자세라믹스 / Sol-Gel 법으로 제조한 (Ba, Sr)TiO3 박막의 전기적 특성
이영희(Young Hie Lee), | 한국전기전자재료학회 | 2000 ,
49
Verifying the Solution from a Nonlinear Solver: A Case Study
Verifying the Solution from a Nonlinear Solver: A Case Study
McCullough, B. D., | American Economic Assn | 2003 ,
50
Semicondactor : Fabrication of Wafer Level Fine Pitch Solder Bump for Flip Chip Application
Semicondactor : Fabrication of Wafer Level Fine Pitch Solder Bump for Flip Chip Application
주철원(Chul Won Ju), | 한국전기전자재료학회 | 2001 ,
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