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461
왕겨분말 복합재료의 기계적 특성에 미치는 제조인자의 영향
왕겨분말 복합재료의 기계적 특성에 미치는 제조인자의 영향
최준용, | 대한기계학회 | 2006 ,
462
Study of PD locaation in generators by PD pluses propagation
Study of PD locaation in generators by PD pluses propagation
Cheng, YangChun, | 한국전기전자재료학회 | 2007 ,
463
A study of construction knowledege management for Taiwan's small and medium-sized enterprises by successful factors
A study of construction knowledege management for Taiwan's small and medium-sized enterprises by successful factors
Tien, Shiaw-Wen, | 한국품질경영학회 | 2006 ,
464
Computer-aided manufacturing
Computer-aided manufacturing
Chang, Tien-Chien, 550.78-C456c | Prentice Hall | 1997 550.78-C456c,
465
Electrochemical Properties of Carbon Nanotube-Dispersed PEO-LiX Electrolytes
Electrochemical Properties of Carbon Nanotube-Dispersed PEO-LiX Electrolytes
Jung-Ho Ahn, Yong-Jin Kim, G. X. Wang, | Korean Institute of Metals and Materials | 2006 ,
466
Giga-Hertz-Level Electromagnetic Field Analysis for Equivalent Inductance Modeling of High-Performance SoC and SiP Designs
Giga-Hertz-Level Electromagnetic Field Analysis for Equivalent Inductance Modeling of High-Performance SoC and SiP Designs
Jason, J. Yao, Keh-Jeng Chang, Wei-Che Chuang, an, | 대한전자공학회 | 2005 ,
467
A New Approach for the Analysis Solution of Dynamic Systems Containing Fractional Derivative
A New Approach for the Analysis Solution of Dynamic Systems Containing Fractional Derivative
Dong-Pyo Hong, Young-Moon Kim, Ji-Zeng Wang, | 대한기계학회 | 2006 ,
468
Drag reduction of a disk with an upstream rod
Drag reduction of a disk with an upstream rod
Panfeng Zhang, Lei Gao Jinjun Wang (China), | 국제구조공학회 | 2006 ,
469
Au-Sn 공정 접합을 이용한 RF MEMS 소자의 Hermetic 웨이퍼 레벨 패키징
Au-Sn 공정 접합을 이용한 RF MEMS 소자의 Hermetic 웨이퍼 레벨 패키징
Qian Wang, 김운배, 좌성훈, 정규동, 황준식, 이문철, 문창렬, 송인상, | 한국마이크로전자및 패키징학회 | 2005 ,
470
Fabrication of Nanostructured Films of Block Copolymers for Nanolithographical Masks
Fabrication of Nanostructured Films of Block Copolymers for Nanolithographical Masks
Dae-Ho Park, Byeong-Hyeok Sohn, Jin Chul Jung, W, | 한국마이크로전자및 패키징학회 | 2005 ,
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