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31
교각 Coping 철근 선조립 공법 적용 소개
교각 Coping 철근 선조립 공법 적용 소개
서영화, 박융구, 이명성, 조성한, | 대한토목학회 | 2003 ,
32
산화된 다공질 실리콘 기판 위에 제작된 MMIC용 Air-Bridge Interconnented Coplanar Waveguides
산화된 다공질 실리콘 기판 위에 제작된 MMIC용 Air-Bridge Interconnented Coplanar Waveguides
심준환, 권재우, 박정용, | 대한전자공학회 | 2002 ,
33
고성능 시스템을 위한 클록 분배 방식 및 Coplanar 및 Microstrip 전송라인의 구조적 분석
고성능 시스템을 위한 클록 분배 방식 및 Coplanar 및 Microstrip 전송라인의 구조적 분석
박정근, 문규, 위재경, | 대한전자공학회 | 2004 ,
34
교류전주법에 의해 제조된 Co(P) 나노선재의 자기적 특성과 인가전압 의존성에 관한 연구 : 전자, 자성 및 광학재료
교류전주법에 의해 제조된 Co(P) 나노선재의 자기적 특성과 인가전압 의존성에 관한 연구 : 전자, 자성 및 광학재료
이관희,김긍호,김이진,정원용, | 대한금속.재료학회 | 2003 ,
35
Dynamic Young's Modulus and Internal Friction in Polycrystalline Copper
Dynamic Young's Modulus and Internal Friction in Polycrystalline Copper
Chang-Seog Kang,Si-Young Chang,Sung-Kil Hong, | 대한금속.재료학회 | 2003 ,
36
Dynamic Shear Stress of Tough-Pitch Copper at High Strain and High Strain-Rate
Dynamic Shear Stress of Tough-Pitch Copper at High Strain and High Strain-Rate
Moon Wonjoo,Seo Songwon,Lim Jaeyoung, Min Oakkey, | 대한기계학회 | 2002 ,
37
Reaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
Reaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
Jeong-Won Yoon,Chang-Bae Lee, | 대한금속.재료학회 | 2003 ,
38
An Electrochemical Study on the Effect of Pitting Inhinition in Weakly Alkaline Solution by Copper Addition in Pure Iron
An Electrochemical Study on the Effect of Pitting Inhinition in Weakly Alkaline Solution by Copper Addition in Pure Iron
Je-Kyoung Kim, | 대한금속.재료학회 | 2003 ,
39
Synthesis of Yttrium Barium Copper Oxide-0.325Ag Supercondeuctors Via Intermediate Precursor With Overall Composition Y:Ba:Cu:O=1:2:3:y,y>7 Preoduced by High-Energy Attrition Milling
Synthesis of Yttrium Barium Copper Oxide-0.325Ag Supercondeuctors Via Intermediate Precursor With Overall Composition Y:Ba:Cu:O=1:2:3:y,y>7 Preoduced by High-Energy Attrition Milling
Haigun Lee, Haiwoong Park,Dokyol Lee, | 대한금속.재료학회 | 2000 ,
40
Fracture of Copper-Based leadframe/EMC Interfaces
Fracture of Copper-Based leadframe/EMC Interfaces
Ho Young Lee, | 대한금속.재료학회 | 2000 ,
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