본문

  1. Home
69 Results:UU:VOLUME3 0.234 sec.
RSS 
Multilingual
 Расширенный поиск
 Новый поиск книги прибытия
Selected Print Select Export to Excel
31
Call Papers on March 2004 Speical Issue on Scaled Nano Devices
Call Papers on March 2004 Speical Issue on Scaled Nano Devices
, | 대한전자공학회 | 2003 ,
32
Call Papers on December 2003 Special Issue on SOC Design
Call Papers on December 2003 Special Issue on SOC Design
, | 대한전자공학회 | 2003 ,
33
Electrostatic Discharge (ESD) and Failure Analysis: Models, Methodologies and Mechanisms for CMOS, Silicon On Insulator and Silicon Germanium Technologies
Electrostatic Discharge (ESD) and Failure Analysis: Models, Methodologies and Mechanisms for CMOS, Silicon On Insulator and Silicon Germanium Technologies
Steven H. Voldman, | 대한전자공학회 | 2003 ,
34
Electrical Characteristics of InA1As/InGaAs/InA1As Pseudomorphic High Electron Mobility Transistors under Sub-Bandgap Photonic Excitation
Electrical Characteristics of InA1As/InGaAs/InA1As Pseudomorphic High Electron Mobility Transistors under Sub-Bandgap Photonic Excitation
H.T.Kim, | 대한전자공학회 | 2003 ,
35
Analog CMOS Performance Degradation due to Edge Direct Tunnelling(EDT) Current in sub-100nm Technology
Analog CMOS Performance Degradation due to Edge Direct Tunnelling(EDT) Current in sub-100nm Technology
Navakanta Bhat, | 대한전자공학회 | 2003 ,
36
Comparison of Retention Characteristics of Ferroelectric Capacitors with Pb(Zr,Ti)O3 Films Deposited by various Methods for High-density Non-volatile Memory
Comparison of Retention Characteristics of Ferroelectric Capacitors with Pb(Zr,Ti)O3 Films Deposited by various Methods for High-density Non-volatile Memory
Sangmin Shin, | 대한전자공학회 | 2003 ,
37
Some Characteristics of Anisotropic Conductive and Non-conductive Adhesive Fili Chip on Flex Interconnections
Some Characteristics of Anisotropic Conductive and Non-conductive Adhesive Fili Chip on Flex Interconnections
J.F.J.M.Caers, | 대한전자공학회 | 2003 ,
38
Stress and Stress Voiding in Cu/Low-k Interconnects
Stress and Stress Voiding in Cu/Low-k Interconnects
Jong-Min Paik, | 대한전자공학회 | 2003 ,
39
Process-Structure-Property Relationship and its Impact on Microelectronics Device Reliability and Failure Mechanism
Process-Structure-Property Relationship and its Impact on Microelectronics Device Reliability and Failure Mechanism
Chih Hang Tung, | 대한전자공학회 | 2003 ,
40
Designing for the Tallest Residential Tower in the World Tower Palace Ⅲ, Seoul, Korea
Designing for the Tallest Residential Tower in the World Tower Palace Ⅲ, Seoul, Korea
Ahmad Abdelrazaq, William F. Baker, | The Korean Society of Steel Structures | 2003 ,
처음이전1234567이후마지막