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381
Weight Control and Knot Placement for Rational B-Spline Curve Interpolation
Weight Control and Knot Placement for Rational B-Spline Curve Interpolation
Tae-Wan Kim,Kumwoo Lee, | 대한기계학회 | 2001 ,
382
Talking about people : readings in contemporary cultural anthropology
Talking about people : readings in contemporary cultural anthropology
Haviland , William A., 331.5-H388t-안진홍 | Mayfield Pub. Co. | 1992 331.5-H388t-안진홍,
383
A System for Rapid Design and Manufacturing of Custom-Tailored Shoes
A System for Rapid Design and Manufacturing of Custom-Tailored Shoes
Sangkun Park,Kunwoo Lee, | 대한기계학회 | 2000 ,
384
Specific Cutting Force Coefficients Modeling of End Milling by Neural Network
Specific Cutting Force Coefficients Modeling of End Milling by Neural Network
Sin-Young Lee,Jang Moo Lee, | 대한기계학회 | 2000 ,
385
Direct Numerical Simulation of 3-Dimensional Axial Turbulent Boundary Layers with Spanwise Curvature
Direct Numerical Simulation of 3-Dimensional Axial Turbulent Boundary Layers with Spanwise Curvature
Dong Shin Shin, | 대한기계학회 | 2000 ,
386
New anisoparametric 3-Node Elements for Out-of-Plane Deformable Curved Beam
New anisoparametric 3-Node Elements for Out-of-Plane Deformable Curved Beam
Kim Moon-Joon,Min Oak-Key, | 대한기계학회 | 2000 ,
387
Curing Induced Residual Stesses in Laminated Cylindrical Shells
Curing Induced Residual Stesses in Laminated Cylindrical Shells
Soo-Yong Lee, | 대한기계학회 | 2000 ,
388
Cubic to Tetragonal Martensitic Trasformationin a Thin Film Elastically Constrained by a Substrate
Cubic to Tetragonal Martensitic Trasformationin a Thin Film Elastically Constrained by a Substrate
S.J.Seol,S.Y.Hu,Y.L.Li, | 대한금속.재료학회 | 2003 ,
389
Effect of Substrate Bias Voltage on the Texture and Microstructure of Cu Thin Films Deposited by Ion Beam Deposition
Effect of Substrate Bias Voltage on the Texture and Microstructure of Cu Thin Films Deposited by Ion Beam Deposition
Jae-Won Lim,Minoru Isshiki, | 대한금속.재료학회 | 2003 ,
390
Reaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
Reaction Diffusions of Cu6Sn5 and Cu₃Sn Intermetallic Compound in the Couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
Jeong-Won Yoon,Chang-Bae Lee, | 대한금속.재료학회 | 2003 ,
처음이전34353637383940414243이후마지막
1
2004 The Costume Culture Association International Conference
복식문화학회 [생활과학, ]
2
Acta Agriculturae Scandinavica: Section A, Animal Science
Taylor & Francis Ltd [, ]
3
Acta Agriculturae Scandinavica: Section B, Soil & Plant Science
Taylor & Francis Ltd [, ]
4
Act for the Prosecution of the Mexican War
Great Neck Publishing [, ]
5
Acupuncture in Medicine
British Medical Acupuncture Society [, ]
6
Acute Cardiac Care
Taylor & Francis Ltd [, ]
7
Acute Care Perspectives
American Physical Therapy Association [, ]
8
Address on Removal of Soviet Weapons from Cuba
Great Neck Publishing [, ]
9
Aerospace Power Journal
Superintendent of Documents [, ]
10
Aging
Superintendent of Documents [, ]
11
Agricultural & Forest Entomology
Blackwell Publishing Limited [, ]
12
Agricultural Adjustment Act of 1933
Great Neck Publishing [, ]
13
Agricultural and Biosystems Engineering
한국농업기계학회 [농업·농학, ]
14
Agricultural Engineering International: CIGR Journal
International Commission of Agricultural Engineering [, ]
15
Agricultural Legislation in First Wilson Administration
Great Neck Publishing [, ]
16
Agricultural Mechanization in Korea
한국농업기계학회 [농업·농학, ]
17
Agricultural Mechanization in Korea
한국농업기계학회 [농학, ]
18
Agricultural Mechanization in Korea
한국농업기계학회 [농학, ]
19
Agricultural Mechanization in Korea
한국농업기계학회 [농학, ]
20
Agricultural Mechanization in Korea
한국농업기계학회 [농학, ]