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21
Separation of Lipid-Soluble Component to Decrease Thermal Oxidation of Lard from Spinach (Spinacia oleracea)
Separation of Lipid-Soluble Component to Decrease Thermal Oxidation of Lard from Spinach (Spinacia oleracea)
Areum Hwang, Moonjung Kim, Eunok Choe, | Korean Societyof Food Science&Technology | 2006 ,
22
Experimental Study on the Thermal Performance of a Small-scale Loop Heat Pipe with Polypropylene Wick
Experimental Study on the Thermal Performance of a Small-scale Loop Heat Pipe with Polypropylene Wick
Joon Hong Boo, Won Bok Chung, | 대한기계학회 | 2005 ,
23
An Experimental Study on the Thermal Performance of a Concentric Annular Heat Pipe
An Experimental Study on the Thermal Performance of a Concentric Annular Heat Pipe
Joon Hong Boo, Soo Yong Park, Do Hyoung KIm, | 대한기계학회 | 2005 ,
24
Thermal Transient Characteristics of Die Attach in High Power LED Package
Thermal Transient Characteristics of Die Attach in High Power LED Package
Hyun-Ho Kim, Sang-Hyun Choi, Sang-Hyun Shin, Youn, | 한국마이크로전자및 패키징학회 | 2005 ,
25
A Synthesis of Spherical Shape TiO₂-SiO₂Complex via Solvothermal Process and Thermal Properties at Non-Isothermal
A Synthesis of Spherical Shape TiO₂-SiO₂Complex via Solvothermal Process and Thermal Properties at Non-Isothermal
Tae-Hwan Cho, Seong-Jin Park, | 한국마이크로전자및 패키징학회 | 2005 ,
26
고집적용 구리배선의 electromigration 및 thermal fatigue 연구
고집적용 구리배선의 electromigration 및 thermal fatigue 연구
김영후, 박영배, Reiner Moning, Cynthia A. Volkert, 주영창, | 한국마이크로전자및 패키징학회 | 2005 ,
27
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Myung Jin Yim, Hyoung Joon Kim, Kyung Wook Paik, | 한국마이크로전자및 패키징학회 | 2005 ,
28
Prevalence and Thermal Stability of Enterobacter sakazakii from Unprocessed Ready-to-Eat Agricultural Products and Powdered Infant Formulas
Prevalence and Thermal Stability of Enterobacter sakazakii from Unprocessed Ready-to-Eat Agricultural Products and Powdered Infant Formulas
Mi-Kyoung Jung, Jong-Hyun Park, | Korean Societyof Food Science&Technology | 2006 ,
29
Application of an inverse BEM to the Modelling Fracturing Process at the Borehole Pillar by Excavation and Thermal Loading
Application of an inverse BEM to the Modelling Fracturing Process at the Borehole Pillar by Excavation and Thermal Loading
Hee-Suk Lee, Lanru Jing, Baotong Shen, | 한국암반공학회 | 2003 ,
30
Fabrication and Characterization of Thermally Actuated Bimorph Probe for Living Cell Measurements with Experimental and Numerical Analysis
Fabrication and Characterization of Thermally Actuated Bimorph Probe for Living Cell Measurements with Experimental and Numerical Analysis
Younghak Cho, Beomjoon Kim, Seokkwan Hong, Jeongj, | 대한기계학회 | 2006 ,
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1
International Symposium on Transport Phenomena in Thermal Engineering
대한기계학회 [, ]
2
International Symposium on Transport Phenomena in Thermal Engineering
대한기계학회 [공학, ]
3
Journal of Thermal Analysis & Calorimetry
Kluwer Academic Publishing / Academic [, ]
4
Journal of Thermal Stresses
Taylor & Francis Ltd [, ]
5
KSME/JSME THERMAL and FLUID Engineering Conference
대한기계학회 [공학, ]
6
KSME/JSME THERMAL and FLUID Engineering Conference
대한기계학회 [, ]
7
Thermal Science
Society of Thermal Engineers of Serbia [, ]