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21
Effect of Packing Size on Chomatographic Separation of Cetechin Compounds in Green Tea
Effect of Packing Size on Chomatographic Separation of Cetechin Compounds in Green Tea
Ji Hoon Kang, Seung Bum Hong, Jung Il Kim, Sung T, | 한국화학공학회 | 2000 ,
22
Thermomechanical Stability of Memory Package with LOC Structure
Thermomechanical Stability of Memory Package with LOC Structure
Seong-Min Lee, | Metals and Materials | 2005 ,
23
Mechanical Strength Test Method for Solder Ball Joint in BGA Package
Mechanical Strength Test Method for Solder Ball Joint in BGA Package
Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung, | Metals and Materials | 2005 ,
24
Antioxidant-impregnated Food Packaging Materials for Inhibition of Lipid Oxidation
Antioxidant-impregnated Food Packaging Materials for Inhibition of Lipid Oxidation
Han-Seung Shin, Younsuk Lee, | Korean Societyof Food Science&Technology | 2003 ,
25
Active Packaging Systems For Preventing Oxidation
Active Packaging Systems For Preventing Oxidation
Kwang Seon Choi, Seok In Hong, Seok Min Son, | 한국산업식품공학회 | 2003 ,
26
Microwave Heating Effect on Mechnacal Properties of Food Packing Films
Microwave Heating Effect on Mechnacal Properties of Food Packing Films
Jun Ho Lee, Eun Ju Seog, Rakesh K. Single, | 한국산업식품공학회 | 2001 ,
27
IEEE 802.17 기반의 Resilient Packet Ring 기술과 표준화 동향
IEEE 802.17 기반의 Resilient Packet Ring 기술과 표준화 동향
이재훈, | 대한전자공학회 | 2005 ,
28
Processing Strategies for Enhanced Resistance to Impact Fracture of Thin Small-Outline Packages
Processing Strategies for Enhanced Resistance to Impact Fracture of Thin Small-Outline Packages
Seong-Min Lee, | 대한금속.재료학회 | 2003 ,
29
MMIC Packaging : MMIC 기술-대특집
MMIC Packaging : MMIC 기술-대특집
김용훈, | 대한전자공학회 | 2002 ,
30
Friction Characteristics of Piston Ring Pack with Consideration of Mixed Lubrication : Parametric Investigation
Friction Characteristics of Piston Ring Pack with Consideration of Mixed Lubrication : Parametric Investigation
Kim Ji-Young,Kim Jee-Woon,Cho Myung-Rae,Han Dong-, | 대한기계학회 | 2002 ,
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1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
3
Advanced Packaging
Penn Well Publishing Co. [, ]
4
Chas Wolff Packing Company v. Court of Industrial Relations of the State of Kansas
Great Neck Publishing [, ]
5
Hewlett-Packard Journal
Hewlett-Packard Co. [, ]