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21
Transient Response of a Permeable Crack Normal to a Piezoelectric-elastic Interface : Anti-plane Problem
Transient Response of a Permeable Crack Normal to a Piezoelectric-elastic Interface : Anti-plane Problem
Soon Man Kwon, Kang Yong Lee, | 대한기계학회 | 2004 ,
22
Interface treatment in shotcrete jacketing of reinforced concrete columns to improve seismic performance
Interface treatment in shotcrete jacketing of reinforced concrete columns to improve seismic performance
Konstantinos G. Vandoros, Stephanos E. Dritsos (G, | 국제구조공학회(TECNO-PRESS) | 2006 ,
23
Teleloperation of Field Mobile Manipulator with Wearable Haptic-based Multi-Modal User Interface and Its Application to Explosive Ordnance Disposal
Teleloperation of Field Mobile Manipulator with Wearable Haptic-based Multi-Modal User Interface and Its Application to Explosive Ordnance Disposal
Dongseok Ryu, Chang-Soon Hwang, Sungchul Kang, Mu, | 대한기계학회 | 2005 ,
24
Effects of Air Void at the Steel-Concrete Interface on the Corrosion Initiation of Reinforcing Stee
Effects of Air Void at the Steel-Concrete Interface on the Corrosion Initiation of Reinforcing Stee
남진각, William H. Hartt, 김기준, | 한국콘크리트학회 | 2005 ,
25
QR, Interface Economy and Pied-Piping in English
QR, Interface Economy and Pied-Piping in English
Jeong-Me Yoon, | 서울대학교 어학연구소 | 2002 ,
26
Interface characteristics of RC beams strengthened with FRP plate
Interface characteristics of RC beams strengthened with FRP plate
Minglan Peng Zhifei Shi, | 국제구조공학회(TECNO-PRESS) | 2004 ,
27
Internet 3D Interface의 원형모델개발에 관한 연구
Internet 3D Interface의 원형모델개발에 관한 연구
이혜원, | 광고학연구 | 2002 ,
28
Computer Organization and Design : the hardware/software interface
Computer Organization and Design : the hardware/software interface
Hennessy, John L., 004.22-H515c | Morgan Kaufmann Publishers | 1994 004.22-H515c,
29
Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications
Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications
J.H. Choy, | 대한금속.재료학회 | 2004 ,
30
Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
J.H. Choy, K.L. Kavanagh, Y.C. Kim, | 대한금속.재료학회 | 2004 ,
처음이전1234567이후마지막
1
Composite Interfaces
VSP International Science Publishers [, ]
2
산업공학 (IE interfaces)
대한산업공학회 [, ]
3
산업공학 (IE interfaces)
대한산업공학회 [공학, ]