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21
Thermal Transient Characteristics of Die Attach in High Power LED Package
Thermal Transient Characteristics of Die Attach in High Power LED Package
Hyun-Ho Kim, Sang-Hyun Choi, Sang-Hyun Shin, Youn, | 한국마이크로전자및 패키징학회 | 2005 ,
22
Assessment and Applications of Multi-Degradable Polyethylene Films as Packaging Materials
Assessment and Applications of Multi-Degradable Polyethylene Films as Packaging Materials
Myong-Soo Chung, Sang-Hyun Lee, Young-Sun You, Hy, | Korean Societyof Food Science&Technology | 2006 ,
23
Thermal Fatigue-Resistant EMCs (Epoxy Molding Compounds) for Microelectronic Encapsulation
Thermal Fatigue-Resistant EMCs (Epoxy Molding Compounds) for Microelectronic Encapsulation
Jong-Woo Bae, Wonho Kim, Suk-Hyeon Cho, Yong-Woo, | 한국화학공학회 | 2000 ,
24
Acaricidal Activity of Essential Oils Derived from 10 Cupressaceae Species against Stored Food and House Dust Mites
Acaricidal Activity of Essential Oils Derived from 10 Cupressaceae Species against Stored Food and House Dust Mites
Bo-Kyung Sung, Moo-Key Kim, Sang-Hyun Lee, Jae-Gw, | Korean Societyof Food Science&Technology | 2004 ,
25
Semi-Active Control of 3D Coupled Response of Building Structures
Semi-Active Control of 3D Coupled Response of Building Structures
Hongjin Kim, Kyung-Won Min, Sang-Hyun Lee, | 대한토목학회 | 2003 ,
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