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21
Material Characterization of Carbon-Nanotube-Reinforced Polymer Composite
Material Characterization of Carbon-Nanotube-Reinforced Polymer Composite
Soon Wan Chung, | 대한금속재료학회 | 2006 ,
22
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
K. W. Lee, | 대한금속재료학회 | 2006 ,
23
Assessment of Indium Joint Strength
Assessment of Indium Joint Strength
Jong Man Kim, | 대한금속재료학회 | 2006 ,
24
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads
Young Kun Jee, | 대한금속재료학회 | 2006 ,
25
Heat Effect and Impact Resistance during Electromigration on Cu-Sn Interconnections
Heat Effect and Impact Resistance during Electromigration on Cu-Sn Interconnections
Tae Kyu Lee, | 대한금속재료학회 | 2006 ,
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