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251
A comparative study of radioprotection with Callophyllis japonica extract and amifostine against lethal whole body gamma irradiation in mice
A comparative study of radioprotection with Callophyllis japonica extract and amifostine against lethal whole body gamma irradiation in mice
Tae-Kyun Shin, | Kyung Hee University Press | 2010 ,
252
OsFCA Transcripts Show More Complex Alternative Processing Patterns than its Arabidopsis Counterparts
OsFCA Transcripts Show More Complex Alternative Processing Patterns than its Arabidopsis Counterparts
Yun Hee Jang, | 한국식물학회(Adventitous Root Formation | 2009 ,
253
Protective effects of Ulmus macrocarpa on experimental colitis mice models
Protective effects of Ulmus macrocarpa on experimental colitis mice models
Park Jae-Woo, | Kyung Hee University Press | 2011 ,
254
Mortgages, Risk, and Homeownership among Low- and Moderate-Income Families
Mortgages, Risk, and Homeownership among Low- and Moderate-Income Families
Bostic, R.W., | American Economic Assn | 2008 ,
255
Characteristics of Nano-crystalline TiO2 Dye-sensitized Solar Cells having Counter Electrodes with Different Preparing Process
Characteristics of Nano-crystalline TiO2 Dye-sensitized Solar Cells having Counter Electrodes with Different Preparing Process
Dong Yoon Lee, | 한국전기전자재료학회 | 2005 ,
256
Dishing and Erosion Evaluations of Tungsten CMP Slurry in the Orbital Polishing System
Dishing and Erosion Evaluations of Tungsten CMP Slurry in the Orbital Polishing System
Sang Ho Lee, | 한국전기전자재료학회 | 2007 ,
257
Diamond Conditioner Wear Characterization for a Copper CMP Process
Diamond Conditioner Wear Characterization for a Copper CMP Process
L. Boruckia, | 한국전기전자재료학회 | 2008 ,
258
Molecular Modification of Perilla Lipid Composition
Molecular Modification of Perilla Lipid Composition
Young Soo Hwang, | 한국식물학회 | 1999 ,
259
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Regular Paper : Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
Hyo Sang Lee, | 한국전기전자재료학회 | 2008 ,
260
Regular Paper : Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization
Regular Paper : Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization
Yun Zhuang, | 한국전기전자재료학회 | 2008 ,
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