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151
Mechanical Characterozation of Nano-Structured Materials Using Nanoindentation
Mechanical Characterozation of Nano-Structured Materials Using Nanoindentation
Ju-Young Kim, | 대한금속재료학회 | 2006 ,
152
Deformation Behavior of TiAl Intermatallic Compounds and Orientation Control by Reactive Diffusion and High-Temperature Uniaxial Compression Deformation
Deformation Behavior of TiAl Intermatallic Compounds and Orientation Control by Reactive Diffusion and High-Temperature Uniaxial Compression Deformation
Kyu-Seop Park, | 대한금속재료학회 | 2006 ,
153
Creep Modeling for Life Evaluation and Strengthening Mechanism of Tungsten Alloyed 9-12% Cr Steels.
Creep Modeling for Life Evaluation and Strengthening Mechanism of Tungsten Alloyed 9-12% Cr Steels.
Kyu-Seop Park, | 대한금속재료학회 | 2006 ,
154
세계각국의 헌법체제 및 개별법체계, Ⅰ : 칠레, 아르헨티나, 알제리, 남아프리카 공화국
세계각국의 헌법체제 및 개별법체계, Ⅰ : 칠레, 아르헨티나, 알제리, 남아프리카 공화국
한국법제연구원, 362-한16세 | 한국법제연구원 | 2009 362-한16세,
155
Experimental Observation on Bond-Slip Behavior between Concrete and CFRP Plate
Experimental Observation on Bond-Slip Behavior between Concrete and CFRP Plate
Dong-Suk Yang, | 한국콘크리트학회 | 2007 ,
156
Adaptive Robust Control Design and Experimental Demonstration for Flexible Joint Manipulators
Adaptive Robust Control Design and Experimental Demonstration for Flexible Joint Manipulators
Dong Hwan Kim, | 대한기계학회 | 2007 ,
157
Recursive Unscented Kalman Filtering based SLAM using a Large Number of Noisy Observations
Recursive Unscented Kalman Filtering based SLAM using a Large Number of Noisy Observations
Seongsoo Lee, | 제어자동화시스템공학회 | 2006 ,
158
Wireless Fieldbus for Networked Control Systems using LR-WPAN
Wireless Fieldbus for Networked Control Systems using LR-WPAN
Dong-Hyuk Choi, | 제어자동화시스템공학회 | 2008 ,
159
Fingerprint Verification Based on lnvariant Moment Features and Nonlinear BPNN
Fingerprint Verification Based on lnvariant Moment Features and Nonlinear BPNN
Ju Cheng Yang, | 제어자동화시스템공학회 | 2008 ,
160
Camera Imaging Lens Fabrication using Wafer-Scale UV Embossing Process
Camera Imaging Lens Fabrication using Wafer-Scale UV Embossing Process
Ho-Seop Jeong, | 한국광학회 | 2006 ,
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