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1
Simply packaging : to capture the ever-evolving art of packaging design and reveal its reflection of the times
Simply packaging : to capture the ever-evolving art of packaging design and reveal its reflection of the times
Cheung, Victor, 658-C526s | Viction:ary | 2008 658-C526s,
2
(Design Matters) Packaging 01 : 시장 경쟁력 강화를 위한 필수 입문서
(Design Matters) Packaging 01 : 시장 경쟁력 강화를 위한 필수 입문서
Capsule, 639.5-C254p | 국제 | 2009 639.5-C254p,
3
Packed Tower 설계기술 : 환경공학 실무를 위한
Packed Tower 설계기술 : 환경공학 실무를 위한
김일배., 539.9-김69p | 처용 | 1999 539.9-김69p,
4
Graphis packaging, 8 : an international compilation of package design, ein internationaler uberblick uber die packungsgestaltung, un repetoire international des formes d'emballage
Graphis packaging, 8 : an international compilation of package design, ein internationaler uberblick uber die packungsgestaltung, un repetoire international des formes d'emballage
Pedersen , B. Martin, 658-P371g | Graphis | 2000 658-P371g,
5
The packaging designer's book of patterns
The packaging designer's book of patterns
Roth , Laszlo, 326.12-R845p | John Wiley | 2000 326.12-R845p,
6
A tutorial guide to Mechanical desktop 5/ Power pack : an ntroduction to modeling for engineering design
A tutorial guide to Mechanical desktop 5/ Power pack : an ntroduction to modeling for engineering design
Lockhart , Shawna D., 530.3-L816t | Prentice Hall | 2001 530.3-L816t,
7
Package design in Japan biennual, 9
Package design in Japan biennual, 9
Japan package design association and rikuyosha,, 658-J35p | Rikuyosha | 2001 658-J35p,
8
와이어샤크를 활용한 실전 패킷 분석 : 시나리오에 따른 상황별 해킹 탐지와 네트워크 모니터링
와이어샤크를 활용한 실전 패킷 분석 : 시나리오에 따른 상황별 해킹 탐지와 네트워크 모니터링
샌더즈 크리스, 004.56-샌24오 | 에이콘 | 2009 004.56-샌24오,
9
Cisco switching black book
Cisco switching black book
Odom, Sean., 005.71-O25c | Coriolis Group Books | 2001 005.71-O25c,
10
Physical architecture of VLSI systems
Physical architecture of VLSI systems
Hannemann, Rob, 005.12-H244p | Wiley | 1994 005.12-H244p,
처음1마지막
1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
3
Advanced Packaging
Penn Well Publishing Co. [, ]
4
Chas Wolff Packing Company v. Court of Industrial Relations of the State of Kansas
Great Neck Publishing [, ]
5
Hewlett-Packard Journal
Hewlett-Packard Co. [, ]