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1
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
Chip-underfill Interfaces of Flip Chip Plastic Ball Grid Array Packages
K. W. Lee, | 대한금속재료학회 | 2006 ,
2
Advanced Automatic Generation Scheme of the Points of Intersection oh a Tendon with Shell Elements Interfaces
Advanced Automatic Generation Scheme of the Points of Intersection oh a Tendon with Shell Elements Interfaces
Jeon, Se Jin, | 대한토목학회 | 2000 ,
3
An Interpretation of the Failure Paths of Roughened Matal-Polymer Interfaces
An Interpretation of the Failure Paths of Roughened Matal-Polymer Interfaces
Ho-Young Lee,Jianmin qu, | 대한금속.재료학회 | 2001 ,
4
Fracture of Copper-Based leadframe/EMC Interfaces
Fracture of Copper-Based leadframe/EMC Interfaces
Ho Young Lee, | 대한금속.재료학회 | 2000 ,
5
Behaviour of Interfacial Layer Along Granular Soil-Structure Interfaces
Behaviour of Interfacial Layer Along Granular Soil-Structure Interfaces
Wenxiong Huang (Australia), Erich Bauer (Austria), | 국제구조공학회 | 2003 ,
처음1마지막
1
Composite Interfaces
VSP International Science Publishers [, ]
2
산업공학 (IE interfaces)
대한산업공학회 [, ]
3
산업공학 (IE interfaces)
대한산업공학회 [공학, ]