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1
Rapid Manufacturing of 3D Micro-products using UV Laser Ablation and Phase-change Filling
Rapid Manufacturing of 3D Micro-products using UV Laser Ablation and Phase-change Filling
Bo Sung Shin., | 한국정밀공학회 | 2006 ,
2
Electrodeposition 변수에 따른 Trench Via의 Cu Filling 특성
Electrodeposition 변수에 따른 Trench Via의 Cu Filling 특성
이광용, | 한국마이크로전자및 패키징학회 | 2006 ,
3
전류인가 방법이 3D-SiP용 Through Via Hole의 Filling에 미치는 영향
전류인가 방법이 3D-SiP용 Through Via Hole의 Filling에 미치는 영향
장근호, | 한국마이크로전자및 패키징학회 | 2006 ,
4
Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling
Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling
J. S. Bae, G. H. Chang, J. H. Lee, | 한국마이크로전자및 패키징학회 | 2005 ,
5
Significance of Gate Geometry and Injection Speed on the Flow Behavior of Molten Al Alloy During Die Filling
Significance of Gate Geometry and Injection Speed on the Flow Behavior of Molten Al Alloy During Die Filling
Jae-Chul Lee, Hyun Kwang Seok, Hong-Kee Lee, | 대한금속.재료학회 | 2005 ,
6
Simulation of Mold Filling and Solidification During Centrifugal Precision Casting of Ti-6Al-4V allioy
Simulation of Mold Filling and Solidification During Centrifugal Precision Casting of Ti-6Al-4V allioy
K. Suzuky and M. Yao, | 대한금속.재료학회 | 2004 ,
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