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1
Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling
Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling
J. S. Bae, G. H. Chang, J. H. Lee, | 한국마이크로전자및 패키징학회 | 2005 ,
2
Electrotribological Behavior of Cu-Ag-Zr Contact Wire against Copper-Base Strip
Electrotribological Behavior of Cu-Ag-Zr Contact Wire against Copper-Base Strip
S. G. Jia, P. Liu, F. Z. Ren, B. H. Tian, M. S. Z, | Metals and Materials | 2005 ,
3
Interpretaion of Evaporation Behavior of Lead from Molten Copper by the Mass-Transfer Model in Fluid Flow
Interpretaion of Evaporation Behavior of Lead from Molten Copper by the Mass-Transfer Model in Fluid Flow
Woo-Gwang Jung, Ho-Sang Sohn, | 대한금속.재료학회 | 2005 ,
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