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1
Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications
Stability of Interface Voids in Copper Metallization for Integrated Circuit Applications
J.H. Choy, | 대한금속.재료학회 | 2004 ,
2
Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
Evolution of Interface Voids under Current and Temperature Stress in Integrate Circuit Metallization
J.H. Choy, K.L. Kavanagh, Y.C. Kim, | 대한금속.재료학회 | 2004 ,
3
Fundamentals of logic design
Fundamentals of logic design
Roth, Charles H., 569.3-R845f | Brooks/Cole | 2004 569.3-R845f,
添加材质信息
添加材质信息
모체등록번호 딸림등록번호 서명 별치기호 자료상태 소장처
W062350 M002282 Fundamentals of logic design CR 대출가능 문학자료실(관광학관1층)
처음1마지막
1
IEE Proceedings -- Circuits, Devices & Systems
IEE [, ]
2
ITC-CSCC :International Technical Conference on Circuits Systems, Computers and Communications
대한전자공학회 [, ]
3
ITC-CSCC :International Technical Conference on Circuits Systems, Computers and Communications
대한전자공학회 [공학, ]
4
Journal of Circuits, Systems & Computers
World Scientific Publishing Company [, ]
5
JTC-CSCC : Joint Technical Conference on Circuits Systems, Computers and Communications
대한전자공학회 [, ]
6
JTC-CSCC : Joint Technical Conference on Circuits Systems, Computers and Communications
대한전자공학회 [공학, ]