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1
Call Papers on March 2004 Speical Issue on Scaled Nano Devices
Call Papers on March 2004 Speical Issue on Scaled Nano Devices
, | 대한전자공학회 | 2003 ,
2
Call Papers on December 2003 Special Issue on SOC Design
Call Papers on December 2003 Special Issue on SOC Design
, | 대한전자공학회 | 2003 ,
3
Electrostatic Discharge (ESD) and Failure Analysis: Models, Methodologies and Mechanisms for CMOS, Silicon On Insulator and Silicon Germanium Technologies
Electrostatic Discharge (ESD) and Failure Analysis: Models, Methodologies and Mechanisms for CMOS, Silicon On Insulator and Silicon Germanium Technologies
Steven H. Voldman, | 대한전자공학회 | 2003 ,
4
Electrical Characteristics of InA1As/InGaAs/InA1As Pseudomorphic High Electron Mobility Transistors under Sub-Bandgap Photonic Excitation
Electrical Characteristics of InA1As/InGaAs/InA1As Pseudomorphic High Electron Mobility Transistors under Sub-Bandgap Photonic Excitation
H.T.Kim, | 대한전자공학회 | 2003 ,
5
Analog CMOS Performance Degradation due to Edge Direct Tunnelling(EDT) Current in sub-100nm Technology
Analog CMOS Performance Degradation due to Edge Direct Tunnelling(EDT) Current in sub-100nm Technology
Navakanta Bhat, | 대한전자공학회 | 2003 ,
6
Comparison of Retention Characteristics of Ferroelectric Capacitors with Pb(Zr,Ti)O3 Films Deposited by various Methods for High-density Non-volatile Memory
Comparison of Retention Characteristics of Ferroelectric Capacitors with Pb(Zr,Ti)O3 Films Deposited by various Methods for High-density Non-volatile Memory
Sangmin Shin, | 대한전자공학회 | 2003 ,
7
Some Characteristics of Anisotropic Conductive and Non-conductive Adhesive Fili Chip on Flex Interconnections
Some Characteristics of Anisotropic Conductive and Non-conductive Adhesive Fili Chip on Flex Interconnections
J.F.J.M.Caers, | 대한전자공학회 | 2003 ,
8
Stress and Stress Voiding in Cu/Low-k Interconnects
Stress and Stress Voiding in Cu/Low-k Interconnects
Jong-Min Paik, | 대한전자공학회 | 2003 ,
9
Process-Structure-Property Relationship and its Impact on Microelectronics Device Reliability and Failure Mechanism
Process-Structure-Property Relationship and its Impact on Microelectronics Device Reliability and Failure Mechanism
Chih Hang Tung, | 대한전자공학회 | 2003 ,
10
Overall Stabilities of Locally Heated Steel Frames under Fire
Overall Stabilities of Locally Heated Steel Frames under Fire
Hiroyuki Suzuki, Ruangtananurak Nara, Hirohumi Fu, | The Korean Society of Steel Structures | 2003 ,
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