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1
Microstructures and Thermal Properties of Polycaprolactone/Epoxy Resin/SiO₂Hybrids
Microstructures and Thermal Properties of Polycaprolactone/Epoxy Resin/SiO₂Hybrids
He Lihua., | 한국접착 및 계면학회 | 2006 ,
2
Magnetothermoelastic stress in orthotropic hollow cylinders due to radially symmetric thermal and mechanical loads
Magnetothermoelastic stress in orthotropic hollow cylinders due to radially symmetric thermal and mechanical loads
H. L. Dai., | 국제구조공학회(TECNO-PRESS) | 2006 ,
3
Vibrations and thermal stability of functionally graded spherical caps
Vibrations and thermal stability of functionally graded spherical caps
T. Prakash., | 국제구조공학회(TECNO-PRESS) | 2006 ,
4
NiCoCrAlY Bond Coat를 사용한 Thermal Barrier Coating의 고온 안정성에 미치는 Pt의 영향
NiCoCrAlY Bond Coat를 사용한 Thermal Barrier Coating의 고온 안정성에 미치는 Pt의 영향
정우석, | 대한금속.재료학회 | 2006 ,
5
Thermal Transient Characteristics of Die Attach in High Power LED Package
Thermal Transient Characteristics of Die Attach in High Power LED Package
Hyun-Ho Kim, Sang-Hyun Choi, Sang-Hyun Shin, Youn, | 한국마이크로전자및 패키징학회 | 2005 ,
6
A Synthesis of Spherical Shape TiO₂-SiO₂Complex via Solvothermal Process and Thermal Properties at Non-Isothermal
A Synthesis of Spherical Shape TiO₂-SiO₂Complex via Solvothermal Process and Thermal Properties at Non-Isothermal
Tae-Hwan Cho, Seong-Jin Park, | 한국마이크로전자및 패키징학회 | 2005 ,
7
고집적용 구리배선의 electromigration 및 thermal fatigue 연구
고집적용 구리배선의 electromigration 및 thermal fatigue 연구
김영후, 박영배, Reiner Moning, Cynthia A. Volkert, 주영창, | 한국마이크로전자및 패키징학회 | 2005 ,
8
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Myung Jin Yim, Hyoung Joon Kim, Kyung Wook Paik, | 한국마이크로전자및 패키징학회 | 2005 ,
9
Thermal vibration analysis of thick laminated plates by the moving least squares differential quadrature method
Thermal vibration analysis of thick laminated plates by the moving least squares differential quadrature method
Lanhe Wu (P. R. China), | 국제구조공학회(TECNO-PRESS) | 2006 ,
10
A Thermal Conductivity Model for Hydrating Concrete Pavements
A Thermal Conductivity Model for Hydrating Concrete Pavements
정진훈, 김낙석, | 한국콘크리트학회 | 2004 ,
처음123이후마지막
1
International Symposium on Transport Phenomena in Thermal Engineering
대한기계학회 [, ]
2
International Symposium on Transport Phenomena in Thermal Engineering
대한기계학회 [공학, ]
3
Journal of Thermal Analysis & Calorimetry
Kluwer Academic Publishing / Academic [, ]
4
Journal of Thermal Stresses
Taylor & Francis Ltd [, ]
5
KSME/JSME THERMAL and FLUID Engineering Conference
대한기계학회 [공학, ]
6
KSME/JSME THERMAL and FLUID Engineering Conference
대한기계학회 [, ]
7
Thermal Science
Society of Thermal Engineers of Serbia [, ]