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1
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Myung Jin Yim, Hyoung Joon Kim, Kyung Wook Paik, | 한국마이크로전자및 패키징학회 | 2005 ,
2
A Thermal Conductivity Model for Hydrating Concrete Pavements
A Thermal Conductivity Model for Hydrating Concrete Pavements
정진훈, 김낙석, | 한국콘크리트학회 | 2004 ,
3
Effects of Water to Rice Ratio and Bulk Density on the Thermal Conductivity of Cooked Rice
Effects of Water to Rice Ratio and Bulk Density on the Thermal Conductivity of Cooked Rice
Young-Jin Lee, Jae-Kun Chun, Tae-Wha Moon, | 한국산업식품공학회 | 2001 ,
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