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1
반도체 Package 공정용 emc gun에 관한 연구
반도체 Package 공정용 emc gun에 관한 연구
조명현, | 대한전자공학회 | 2006 ,
2
Effect of High Oxygen Modified Atmosphere Packaging on Quality and Marketability of Leaf Lettuce
Effect of High Oxygen Modified Atmosphere Packaging on Quality and Marketability of Leaf Lettuce
Jong Nam Park, Jang Hyn Kyoung, Wie Soo Kang, Che, | 한국원예학회 | 2006 ,
3
Effect of Active Modified Atmosphere Packaging and Storage Temperature on the Quality of Spinach
Effect of Active Modified Atmosphere Packaging and Storage Temperature on the Quality of Spinach
Jong Nam Park, Jang Hun Kyoung, Cheon Soon Jeong, | 한국원예학회 | 2006 ,
4
Rectangle Packing 방식 기반 NoC 테스트 스케쥴링
Rectangle Packing 방식 기반 NoC 테스트 스케쥴링
안진호, 김근배, 강성호, | 대한전자공학회 | 2006 ,
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1
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [공학, ]
2
Advanced and Future Microelectronics Workshop - Advanced Packaging Technology -
대한전자공학회 [, ]
3
Advanced Packaging
Penn Well Publishing Co. [, ]
4
Chas Wolff Packing Company v. Court of Industrial Relations of the State of Kansas
Great Neck Publishing [, ]
5
Hewlett-Packard Journal
Hewlett-Packard Co. [, ]