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1
Thermal Transient Characteristics of Die Attach in High Power LED Package
Thermal Transient Characteristics of Die Attach in High Power LED Package
Hyun-Ho Kim, Sang-Hyun Choi, Sang-Hyun Shin, Youn, | 한국마이크로전자및 패키징학회 | 2005 ,
2
A Synthesis of Spherical Shape TiO₂-SiO₂Complex via Solvothermal Process and Thermal Properties at Non-Isothermal
A Synthesis of Spherical Shape TiO₂-SiO₂Complex via Solvothermal Process and Thermal Properties at Non-Isothermal
Tae-Hwan Cho, Seong-Jin Park, | 한국마이크로전자및 패키징학회 | 2005 ,
3
고집적용 구리배선의 electromigration 및 thermal fatigue 연구
고집적용 구리배선의 electromigration 및 thermal fatigue 연구
김영후, 박영배, Reiner Moning, Cynthia A. Volkert, 주영창, | 한국마이크로전자및 패키징학회 | 2005 ,
4
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced thermal Conductivity
Myung Jin Yim, Hyoung Joon Kim, Kyung Wook Paik, | 한국마이크로전자및 패키징학회 | 2005 ,
5
Transient thermal stresses of orthotropic functionally graded thick strip due to nonuniform heat supply
Transient thermal stresses of orthotropic functionally graded thick strip due to nonuniform heat supply
Yoshihiro Ootao, Yoshinobu Tanigawa, | 국제구조공학회(TECNO-PRESS) | 2005 ,
6
Transient wave propagation in piezoelectric hollow spheres subjected to thermal shock and electric excitation
Transient wave propagation in piezoelectric hollow spheres subjected to thermal shock and electric excitation
H. L. Dai, X. Wang, | 국제구조공학회(TECNO-PRESS) | 2005 ,
처음1마지막
1
International Symposium on Transport Phenomena in Thermal Engineering
대한기계학회 [, ]
2
International Symposium on Transport Phenomena in Thermal Engineering
대한기계학회 [공학, ]
3
Journal of Thermal Analysis & Calorimetry
Kluwer Academic Publishing / Academic [, ]
4
Journal of Thermal Stresses
Taylor & Francis Ltd [, ]
5
KSME/JSME THERMAL and FLUID Engineering Conference
대한기계학회 [공학, ]
6
KSME/JSME THERMAL and FLUID Engineering Conference
대한기계학회 [, ]
7
Thermal Science
Society of Thermal Engineers of Serbia [, ]