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911
Seed pelleting and bacterization of Sesame for plant growth enhancement and soil borne disease control
Seed pelleting and bacterization of Sesame for plant growth enhancement and soil borne disease control
Kim S. H., C. S. Park, H. J. Cho, S. M. Lee, | 한국작물학회 | 2001 ,
912
Isolation of wounding or low temperature inducible genes in Glycin max. L
Isolation of wounding or low temperature inducible genes in Glycin max. L
Seong-Whan Park, Kee-Young Kim, Ja-Woong Kim, Min, | 한국작물학회 | 2001 ,
913
The latest Trend of Laser Materials Processing
The latest Trend of Laser Materials Processing
Akira Matsunawa, | 대한용접학회 | 2006 ,
914
Spatial Patterns and Temporal Variability of the Haines Index related to the Wildland Fire Growth Potential over the Korean Peninsula
Spatial Patterns and Temporal Variability of the Haines Index related to the Wildland Fire Growth Potential over the Korean Peninsula
Choi Gwangyong, | 대한지리학회 | 2006 ,
915
Breeding of the Early Pear Cultivar 'Gamro' (Pyrus pyrifolia) with High Quality for Summer Season
Breeding of the Early Pear Cultivar 'Gamro' (Pyrus pyrifolia) with High Quality for Summer Season
Whee Cheon Kim, | 한국원예학회 | 2006 ,
916
An Empirical Analysis of the Management Accomplishments by Foreign Enterprises in Local Korea : Focused on Differences between sole venture and joint venture
An Empirical Analysis of the Management Accomplishments by Foreign Enterprises in Local Korea : Focused on Differences between sole venture and joint venture
Shin Kwang Ha, | 국제지역학회 | 2006 ,
917
Compositions of Methanol Extract from Hwangryeon (Coptidis rhizoma) and Antimicrobial Activity against Food Spoilage and Foodborne Disease Microorganisms
Compositions of Methanol Extract from Hwangryeon (Coptidis rhizoma) and Antimicrobial Activity against Food Spoilage and Foodborne Disease Microorganisms
Mee Kyong Lim, | 대한가정학회 | 2006 ,
918
Modeling Service based on XML Schema for MPEG Multimedia Midleware
Modeling Service based on XML Schema for MPEG Multimedia Midleware
Hendry, Munchurl Kim, | 한국멀티미디어학회 | 2006 ,
919
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Interfacial Reaction between 42Sn-58Bi Solder and Electroless Ni-P/Immersion AU UBM during Aging
Moon Gi Cho, Hyuck Mo Lee, Seong Woon Booh, Tae-, | 한국마이크로전자및 패키징학회 | 2005 ,
920
Practical Application of Sn-3.0Ag-0.5Cu Lead Free Solder in Electronic Production
Practical Application of Sn-3.0Ag-0.5Cu Lead Free Solder in Electronic Production
Kyu-Sang Chae, Jae-Sang Min, Ik-Joo Kim, Il-Je Cho, | 한국마이크로전자및 패키징학회 | 2005 ,
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